|28-04-2010, 08:50 PM||#1|
Join Date: May 19 2008
[Techpowerup.com] (PR) Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry's first multi-chip package (MCP) with PRAM - for use in mobile handsets beginning later this quarter.
The 512 megabit Samsung PRAM in the MCP is backward compatible with 40 nanometer-class* NOR flash memory in both its hardware and software functionality, allowing mobile handset designers the convenience of having multi-chip packaging fully compatible with past stand-alone PRAM chip technology. PRAM is expected to be widely embraced by next year as the successor to NOR flash in consumer electronics designs, to become a major memory technology.
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