|28-04-2010, 08:50 PM||#1|
Join Date: May 19 2008
[Techpowerup.com] (PR) Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry's first multi-chip package (MCP) with PRAM - for use in mobile handsets beginning later this quarter.
The 512 megabit Samsung PRAM in the MCP is backward compatible with 40 nanometer-class* NOR flash memory in both its hardware and software functionality, allowing mobile handset designers the convenience of having multi-chip packaging fully compatible with past stand-alone PRAM chip technology. PRAM is expected to be widely embraced by next year as the successor to NOR flash in consumer electronics designs, to become a major memory technology.
|chip, industry’s, multichip, package, pram, samsung, ships, techpowerupcom|
|Currently Active Users Viewing This Thread: 1 (0 members and 1 guests)|
|Similar Threads for: [Techpowerup.com] (PR) Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip|
|Thread||Thread Starter||Forum||Replies||Last Post|
|[Techpowerup.com] (PR) Samsung Rolls Out 30nm-class 8 Gb OneNAND Chip||News||Reviews & News Online||0||07-05-2010 02:50 AM|
|[Techpowerup.com] (PR) Samsung Producing Industry’s First Higher-performing 20nm-class NAND Flash Memory||News||Reviews & News Online||0||20-04-2010 07:40 AM|
|[Techpowerup.com] (PR) Samsung Announces Industry’s First Production of 30-nm-class, 3-bit MLC NAND Flash||News||Reviews & News Online||0||02-12-2009 04:40 AM|
|[Techpowerup.com] (PR) Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8chip Package||News||Reviews & News Online||0||05-11-2009 10:30 AM|
|[Techpowerup.com] Samsung PRAM Reaches Production in June||News||Reviews & News Online||0||06-05-2009 11:11 PM|
All times are GMT +11. The time now is 09:28 PM.