DFI LP UT X48-T3RS
Info, overclocking tips & photos

Courtesy of DFI Taiwan, I'll have the opportunity to check out DFI's first DDR3 motherboard, DFI Lanparty UT X48-T3RS based on Intel X48 chipset. I also have the DFI Lanparty UT X48-T2R DDR2 version of the motherboard which I'll be testing as well. This is the review thread while I've setup a dedicated discussion thread here.

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DFI LP UT X48-T3RS Photos

For DDR2 boards, the only difference between DFI Lanparty UT X48-T2R and Lanparty LT X48-T2R is meant to be that the UT version sports the new Thermalright made heatpipe based heatsink for northbridge, southbridge and mosfet area called Flame Freezer.

The DFI LP UT X48-T3RS DDR3 version also uses the same Flame Freezer heatpipe cooling kit. The kit consists of a 90 degree angled transpiper heatsink to provide additional cooling to mosfet area near I/O connector, a flame freezer heatpipe assembly which cools the northbridge, southbridge and mosfet area and interchangeable northbridge heatsink which can be unclipped and removed so you can replace it with Thermalright's HR-05 series northbridge heatsink.

I decided to fully utilise the additional cooling provided as follows:

1. Unclip the northbridge heatsink and install my spare Thermalright HR-05 chipset heatsink and used some MX-2 thermal paste to cover the base of the HR-05 heatsink before mounting it via the DFI provided clip to the northbridge heatpipe assembly base.
2. Install 90 degree transpiper Flame Freezer heatsink, by unscrewing the small retention mounting plate. The manual doesn't mention any use of thermal paste here but I decided to apply a bit of MX-2 to retention mounting plate and then rotated it around the 90 degree transpiper heatpipe to spread the MX-2 before installing.
3. If you plan on removing the heatpipe assembly, the northbridge and southbridge hole diameters are ~55mm and ~54mm respectively.

More photos here.


Notes: (continually updated)

• PCI-E 1 & PCI-E 3 slots are for x16. Probably why DFI included a longer Crossfire bridge connector cable in the box.
• 2+4 Yellow dimm slots are meant to clock memory higher than 1+3 Green dimm slots.
• Updated: 8/29 bioses fixed the HD4870x2 incompatibilities
• 6/4 beta bios expanded the DDRAM Default Skew Model with 4 options - each model is tailored for specific ICs. Model 3 is most suited to Micron D9 DDR3, while Samsung, Elipida, and Qimonda IC based DDR3 modules might like the other Models more. For example, DFI managed to get Micron D9 1GB single side modules to hit DDR3-2000MHz at CL7.
• 6/4 beta bios, introduction of Fine Delay Step Degree - this changes the way clock fine delay values are manually set, you can fine tune them to be closer to current auto values now via the Fine Delay Step Degree (80 steps) + Degree increments (31 degrees) for each clock fine delay option. Example here.
• 6/9 beta bios seems to have dramatically improved memory overclocking especially with 7-7-7-x memory timings.

Downloads:

• Beta Bios http://dfi.com.tw/portal/CM/cmproduc...lse&itemId=541
• Official Bios http://dfi.com.tw/portal/CM/cmproduc...lse&itemId=541
• Product Page http://dfi.com.tw/portal/CM/cmproduc...lse&itemId=541
• Drivers http://dfi.com.tw/portal/CM/cmproduc...lse&itemId=541

Beta Bios:

• 12/24 beta bios - BIOS enhanced the 16GB memory compatibility issue
• 9/23 beta bios - 1. Added F9 Hot Key function, 2. Fixed ABS function fail when upgrade BIOS, 3. Fixed System cannot display when "two" ATI HD 4870X2 are used in Crossfire, 4. Update Intel new 45nm CPU micro code.
• 8/29 beta bios - 1. Fixed system can't display when built ATI HD 4870 X2 Cross Fire Edition. 2. Update Intel new 45nm CPU micro code.
• 8/21 beta bios - 1. Fixed system can't display when insert ATI HD 4870 X2 Graphic card, 2. Added ABS profile version control for UT/LT X38/X48 series.
• 7/25 beta bios - 1. Fixed system can not display with some Graphic card, 2. Optimized system O.C. function, 3. Fixed on board audio record function, 4. Fixed “Execute Disable Bit” function fail, 5. Fixed USB keyboard fail to hot key to reload CMOS.
• 7/14 beta bios - 1. Fixed system can not display with some Graphic card, 2. Optimized system O.C. function, 3. Fixed on board audio record function, 4. Fixed “Execute Disable Bit” function fail.
• 6/27 beta bios - Improved G.Skill Memory compatibility issue.
• 6/20 beta bios - Improved Memory compatibility & Enhance system OC function.
• 6/9 beta bios - visually I only see the 6 MCH GTL Ref voltages being removed. Everything else looks like 6/4 beta within bios.

Official Bios:

• 9/23 official bios - highly recommended. 1. Added F9 Hot Key function, 2. Fixed ABS function fail when upgrade BIOS, 3. Fixed System cannot display when "two" ATI HD 4870X2 are used in Crossfire, 4. Update Intel new 45nm CPU micro code.
• 8/29 official bios - 1. Fixed system can't display when built ATI HD 4870 X2 Cross Fire Edition. 2. Update Intel new 45nm CPU micro code.
• 8/07 official bios - Fixed The system can't display with ATI HD 4870 X2 Graphic card.
• 7/25 official bios
• 6/9 official bios
• 5/21 official bios
• 4/30 official bios - initial bios

Other DFI Lanparty UT X48-T3RS Reviews

• DFI UT X48-T3RS LanParty - Living Review

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